Intel Xeon 6
Applications
AI
- Image recognition and classification
- Natural Language Processing (incl. Gen AI)
- Recommendation Systems
HPC
- Earth System
- Financial Services
- Life & Material Sciences
- Manufacturing
- Models and large-scale calculations
- CAE and modeling
Storage
- Hyper-converged infrastructure
- Database management systems
- Virtual machine storage
Edge
- Encryption and compression
- Secure access service edge (SASE)
- Inspection, antivirus, intrusion prevention and detection
- Video structurization server (VSS)
Analytics
- Big Data analytics
- Predictive analytics
- Business intelligence
- Database, CRM
- Data visualisation
- Real-time analytics
- Machine learning
Networking
- Content delivery network (CDN)
- Network security appliances
- Next-gen firewall (NGFW)
- Real-time deep packet
Cloud Computing
- Software-as-a-Service (Saas)
- Infrastructure-as-a-Service (Iaas)
- Platform-as-a-Service (Paas)
- File Sharing and Data Storage
- Data Governance
Server Motherboards
D5062
- DC-MHS M-FLW HPM
- Dimensions : 423mm x 348mm
- Dual Intel® Xeon® 6 processors, TDP up to 350W
- (32) DDR5 DIMM slots, 2DPC, up to 6400MT/s RDIMM and 8000MT/s MCRDIMM (1DPC)
- (1) PCIe 5.0 x16 OCP 3.0 NIC slots
- (2) M.2 2280/22110 PCIe 5.0 x2 ports
- (8) PCIe 5.0 x 8 MCIO 8i
- (5) PCIe 5.0 x 16 MXIO(SFF-TA-1033)
- (2) E1.S PCIe5.0 x4 ports
- Support DC-SCM2 with AST2600 BMC
D3061
- DC-MHS M-DNO Type-2 HPM
- Dimensions: 305.59mm x 210mm
- Single Intel® Xeon® 6 processor, TDP up to 350W
- (16) DDR5 DIMM slots, 2DPC, up to 6400MT/s RDIMM and 8000MT/s MCRDIMM (1DPC)
- (1) PCIe 5.0 x16 OCP 3.0 NIC slots
- (2) M.2 2280/22110 PCIe 5.0x2 ports
- (8) PCIe5.0 x8 MCIO 8i
- Support DC-SCM2 Server Management Module with AST2600 BMC (MSI MGT1)
D3066
- DC-MHS M-DNO Type-4 HPM
- Dimensions: 305.95mm x 295mm
- Single Intel® Xeon® 6 processor, TDP up to 350W
- (16) DDR5 DIMM slots, 2DPC, up to 6400MT/s RDIMM and 8000MT/s MCRDIMM (1DPC)
- (2) PCIe 5.0 x16 OCP 3.0 NIC slots
- (2) M.2 2280/22110 PCIe 5.0 x2 ports
- (6) PCIe 5.0 x 8 MCIO 8i
- (3) PCIe 5.0 x 16 MXIO(SFF-TA-1033)
- Support DC-SCM2 Server Management Module with AST2600 BMC (MSI MGT1)
D3071
- DC-MHS M-DNO Type-2 HPM
- Dimensions: 305.59mm x 210mm
- Single Intel® Xeon® 6 processors, TDP up to 500W
- (12) DDR5 DIMM slots, 12 channels per CPU (1DPC), up to 6400MT/s RDIMM and 8800MT/s MCRDIMM (1DPC)
- (1) PCIe 5.0 x16 OCP 3.0 NIC slots
- (2) M.2 2280/22110 PCIe 5.0x2 ports
- (9) PCIe5.0 x8 MCIO 8i
- Support DC-SCM2 Server Management Module with AST2600 BMC (MSI MGT1)
Server Barebones
CX170-S5062
- 1U Enterprise Server, DC-MHS architecture
- Dual Intel® Xeon® 6 processors, TDP up to 350W(Air cooled)
- (32) DDR5 DIMM slots, 2DPC, up to 6400MT/s RDIMM and 8000MT/s MCRDIMM (1DPC)
- (1) PCIe 5.0 x16 OCP 3.0 NIC slot
- (2) M.2 2280/22110 PCIe 5.0 x2 ports
- (2) Rear E1.S 9.5mm PCIe 5.0 x4 ports
- (2) PCIe 5.0 x16 FHHL single-wide slots
- (12) 2.5" PCIe 5.0x4 U.2 NVMe
CX270-S5062
- 2U Enterprise Server, DC-MHS architecture
- Dual Intel® Xeon® 6 processors, TDP up to 350W(Air cooled)
- (32) DDR5 DIMM slots, 2DPC, up to 6400MT/s RDIMM and 8000MT/s MCRDIMM (1DPC)
- (1) PCIe 5.0 x16 OCP 3.0 NIC slot
- (2) M.2 2280/22110 PCIe 5.0 x2 ports
- (2) Rear E1.S 9.5mm PCIe 5.0 x4 ports
- Max (6) PCIe 5.0 x16 slots support max (2) 350W DW GPU
- Max (24) 2.5" PCIe 5.0 x4 U.2 NVMe
CD270-S3061-X4
- 2U4N Core Compute Server, DC-MHS architecture
- Single Intel® Xeon® 6 processor, TDP up to 350W (per node)
- (16) DDR5 DIMM slots, 2DPC, up to 6400MT/s RDIMM and 8000MT/s MCRDIMM (1DPC)
- (1) PCIe 5.0 x16 OCP 3.0 NIC slot (per node)
- (2) M.2 2280/22110 PCIe 5.0 x2 ports (per node)
- (3) 2.5" PCIe 5.0 x4 U.2 NVMe (per node)
CX271-S3066
- 2U Enterprise Server, DC-MHS architecture
- Single Intel® Xeon® 6 processor, TDP up to 350W
- (16) DDR5 DIMM slots, 2DPC, up to 6400MT/s RDIMM and 8000MT/s MCRDIMM (1DPC)
- (2) PCIe 5.0 x16 OCP 3.0 NIC slots
- (2) M.2 2280/22110 PCIe 5.0 x2 ports
- (2) PCIe 5.0 x16 FHFL slots support DW 350W GPU
- (1) PCIe 5.0 x16 HHHL slot
- Max (24) 2.5" PCIe 5.0 x4 U.2 NVMe
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